Advanced Cu interconnects using air gaps
- Resource Type
- Article
- Authors
- Gosset, L.G.; Farcy, A.; de Pontcharra, J.; Lyan, Ph.; Daamen, R.; Verheijden, G.J.A.M.; Arnal, V.; Gaillard, F.; Bouchu, D.; Bancken, P.H.L.; Vandeweyer, T.; Michelon, J.; Hoang, V. Nguyen; Hoofman, R.J.O.M.; Torres, J.
- Source
- In Microelectronic Engineering 2005 82(3):321-332
- Subject
- Language
- ISSN
- 0167-9317