The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
- Resource Type
- Article
- Source
- In
Journal of Alloys and Compounds 15 November 2016 685:471-482 - Subject
- Language
- ISSN
- 0925-8388