Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints
- Resource Type
- Article
- Source
- In
Transactions of Nonferrous Metals Society of China 2006 16 Supplement 2:s739-s743 - Subject
Characterization, Test and Evaluation of Materials - Language
- ISSN
- 1003-6326