On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing
- Resource Type
- Article
- Authors
- Civale, Yann; Croes, Kristof; Miyamori, Yuichi; Velenis, Dimitrios; Redolfi, Augusto; Thangaraju, Sarasvathi; Ammel, Annemie Van; Cherman, Vladimir; Plas, Geert Van der; Cockburn, Andrew; Gravey, Virginie; Kumar, Nirajan; Cao, Zhitao; Travaly, Youssef; Tőkei, Zsolt; Beyne, Eric; Swinnen, Bart
- Source
- In Microelectronic Engineering June 2013 106:155-159
- Subject
- Language
- ISSN
- 0167-9317