A study on ranking of commercial fluxes for electrochemical migration (ECM) propensity for Cu, Sn and Ag surface finishes
- Resource Type
- Conference
- Authors
- Canumalla, S.; Ludwig, K.; Pedigo, R.; Fitzgerald, T.
- Source
- 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :8 pp. 2006
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Electrochemical machining
Tin
Surface finishing
Electronic countermeasures
Humidity
Surface resistance
Insulation
Electronic equipment testing
Costs
Pollution measurement
- Language
- ISSN
- 0569-5503
2377-5726
This study extends the water drop test to allow for quantitative measurement of the electrochemical migration (ECM) behavior of several commercial solder fluxes. The technique developed affords a quick and approximate way to rank and select fluxes based on ECM propensity in applications where condensing humidity or ingress of liquids occurs in the use environment.