Advanced process control applications for advanced CMP process
- Resource Type
- Conference
- Authors
- Jun Yang; Yi Shih Lin; Yang, SiYuan Frank; Yi Huang; Qun Shao; Hongtao Liu
- Source
- 2015 China Semiconductor Technology International Conference Semiconductor Technology International Conference (CSTIC), 2015 China. :1-3 Mar, 2015
- Subject
- Bioengineering
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Production
Process control
Safety
Software
Radio access networks
Tuning
Semiconductor device modeling
advanced process control
chemical mechanical polishing
profile control
run to run control
partition
safety guarding features
- Language
- ISSN
- 2158-2297
There are increasing new needs for advanced process control (APC) from chemical mechanical polishing (CMP) process along with the technology nodes advancing to 28nm and below. Besides traditional applications for wafer to wafer and batch to batch thickness variation reduction, and feed-forward based on incoming thickness/depth, the other new needs include within wafer uniformity control based on consumable counts and incoming profile, preventing polishing rate from dropping due to disk and pad deteriorating etc. This paper discusses those APC applications for CMP processes and along with important features which advanced APC software should equip with.