An approach to life consumption monitoring of solder joints in operating temperature environment
- Resource Type
- Conference
- Authors
- Johansson, Jonas; Belov, Ilja; Johnson, Erland; Leisner, Peter
- Source
- 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on. :1/8-8/8 Apr, 2012
- Subject
- Robotics and Control Systems
Components, Circuits, Devices and Systems
Computing and Processing
Monitoring
Lead
Compounds
Hardware
Physics
Joints
Polymers
- Language
This paper elaborates the 3T-approach to life consumption monitoring of solder joints in operating temperature environment without requiring simplification of operating loads.