Attaining Single-Chip, High-Performance Computing through 3D Systems with Active Cooling
- Resource Type
- Periodical
- Authors
- Coskun, Ayse; Atienza, David; Sabry, Mohamed; Meng, Jie
- Source
- IEEE Micro Micro, IEEE. 31(4):63-75 Aug, 2011
- Subject
- Computing and Processing
Three dimensional displays
Manufacturing
Stacking
Heat sinks
Thermal management
Microchannel
multiprocessor systems
emerging technologies
energy-aware systems
temperature-aware design
active cooling
3D liquid-cooled systems
- Language
- ISSN
- 0272-1732
1937-4143
This article explores the benefits and the challenges of 3D design and discusses novel techniques to integrate predictive cooling control with chip-level thermal-management methods such as job scheduling and voltage frequency scaling. Using 3D liquid-cooled systems with intelligent runtime management provides an energy-efficient solution for designing single-chip many-core architectures.