Stress-free thin die support system(TDSS) for die handling, assembly, and carrier de-bonding is demonstrated. Silicon wafer is back-grinded and singulated with glass carrier. Since thick(700µm) glass carrier is bonded after singulation, it is easy to handle and assemble chip on substrate. UV(Ultra-Violet) and IR(Infra-Red) laser are adopted to release adhesive tape between glass carrier and silicon wafer. Force of detaching glass carrier from silicon die is measured with die size porous chuck and manual debonding module. In conclusion, stress-free thin die de-bonding process is obtained in both UV and IR light sources.