3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects
- Resource Type
- Conference
- Authors
- Daudlin, Stuart; Rizzo, Anthony; Abrams, Nathan C.; Lee, Sunwoo; Khilwani, Devesh; Murthy, Vaishnavi; Robinson, James; Collier, Terence; Molnar, Alyosha; Bergman, Keren
- Source
- 2021 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2021. :1-3 Jun, 2021
- Subject
- Communication, Networking and Broadcast Technologies
Photonics and Electrooptics
Filtering
Multichip modules
Bandwidth
Receivers
Wavelength division multiplexing
Transceivers
Optical fiber communication
- Language
We present the architecture and assembly of a compact, 3D-integrated CMOS-silicon photonic transceiver for DWDM interconnects. The transceiver interleaves 64 parallel wavelength channels enabling energy efficient scaling of multi-Tbps/mm 2 bandwidth densities for future co-packaged chipsets. © 2021 The Author(s)