IGBT Thermal Model Theory and Analysis for Device-To-System-Level Electrothermal Simulations
- Resource Type
- Conference
- Authors
- Lu, Yiping; Xiang, Enyao; Zhu, Lin; Luo, Haoze; Yang, Huan; Zhao, Rongxiang
- Source
- 2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS) Power Electronics and Application Symposium (PEAS), 2023 IEEE 2nd International. :1890-1895 Nov, 2023
- Subject
- Power, Energy and Industry Applications
Insulated gate bipolar transistors
Analytical models
Temperature
Simulation
Electronic packaging thermal management
Power electronics
Thermal analysis
Thermal network model
device-to-system
junction temperature
model accuracy
- Language
Based on the different requirements for the IGBT thermal model from the device to the system level, the different timescales of the time constants of each layer of the device package structure are used to establish an IGBT thermal model for device-to-system-level thermal simulations. Simulation results verify its accuracy.