Improving Board Level Reliability of Ultra Thin PCBA by Systematic Novel Solutions
- Resource Type
- Conference
- Authors
- Jiang, Yiming; Shi, Hongbin; Li, Mengyuan; Lv, Xiang
- Source
- 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :922-925 Dec, 2023
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Encapsulation
Systematics
Capacitors
Finite element analysis
Reliability
Optimization
Electronics packaging
- Language
This research investigated several methods of enhancing the reliability of SMD capacitors and SMD capacitors packages on thin PCB, by using Finite Element Analysis. The effect of solder paste of SAC305 and SAC105 are compared. The results show that using solder paste of SAC105 can enhance the reliability of QFN packages on thin PCB. The effect of encapsulation adhesives, are compared. By using encapsulation can enhance the reliability of QFN packages on thin PCB. The optimization of pad designs of the PCB and the SMD capacitors and SMD capacitors packages are investigated. Optimized pad of the PCB and the QFN packages can enhance the reliability of QFN packages.