It is of great importance to quickly remove airborne molecular contaminants (AMC) which cause defects during manufacturing process. To this end. it may be essential to accurately predict the spatiotemporal distribution of AMC which strongly depends not only on the flow patterns inside a cleanroom, but also on their source characteristics such as magnitude and location. Also, in FABs, particulate matter (PM) as well as other air pollutants (e.g., volatile organic compounds (VOCs), acid and alkaline gases, and heavy metals) has been controlled to maintain product quality, improve yields, protect equipment, and ensure worker safety. Those approaches for the intelligent FAB will provide sustainable environmental control solution for the advanced semiconductor manufacturing intelligent FAB.