Effect of Green Additive Sarcosine as Inhibitor for Cobalt-Based Copper Interconnect CMP
- Resource Type
- Conference
- Authors
- Dong, Changxin; Niu, Xinhuan; He, Chao; Li, Xinjie; Yan, Han
- Source
- 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) Science and Technology for Integrated Circuits (CSTIC), 2024 Conference of. :1-3 Mar, 2024
- Subject
- Bioengineering
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Photonics and Electrooptics
Inhibitors
Adsorption
Corrosion
Force
Dynamics
Integrated circuit interconnections
Surface roughness
sarcosine
inhibitor
cobalt
Chemical Mechanical polishing (CMP)
- Language
Chemical mechanical polishing (CMP) is one of the most effective methods to achieve atomic-scale smooth surface. Each component of the slurry plays an important role in the CMP process. The effect of sarcosine as inhibitors for cobalt-based Cu interconnected CMP was studied in this article. And its mechanism of action was analyzed by electrochemical experiments and atom force microscope (AFM).