A comprehensive approach towards metallization of TOPCon cells is undertaken. Conventional screen printing, standard lasered Ni-Cu plated contacts and combination of laser with screen printing approaches are compared and evaluated in terms of increase of recombination current ($\Delta\mathrm{j}_{0}$) and contact resistivity ($\rho_{\mathrm{c}}$). Screen printed contact's resistivity, both with and without laser ablation, fired at 840 °C stabilize between $2-4\ \mathrm{m}\Omega$ cm 2 . In comparison, the electroplated contacts reach resistivity levels as low as .2\pm 0.1\ \mathrm{m}\Omega$ cm 2 . Non-lasered contacts display minimal to nil increase in recombination, where as the lasered contacts exhibit an increased recombination current in range of 10–20 fA / cm2 .