Flexible MEMS-IC Microsystem by a Wafer-Level F-eSiFO Integration Process
- Resource Type
- Conference
- Authors
- Chen, Lang; Xu, Han; Zhang, Chi; Wang, Wei
- Source
- 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :701-704 Jan, 2024
- Subject
- Bioengineering
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Power, Energy and Industry Applications
Micromechanical devices
Wiring
Packaging
Silicon
Skin
Flexible electronics
Surface treatment
MEMS-IC integration
Flexible Microsystem
Parylene-MEMS
Wafer-level manufacturing
- Language
- ISSN
- 2160-1968
This paper reports a novel F-eSiFO fabrication strategy of flexible microsystems based on the mature eSiFO (Embedded Silicon Fan-Out) technology. Heterogeneous dielets were embedded onto a silicon interposer and flexibly interconnected by the Parylene-MEMS process. The electrical wiring between different dielets realized ultra-fine line width and ultra-small pitches (L/S≤2μm). The F-eSiFO prepared high-density flexible microsystem presented stretchability at 33.3% ± 4.41% and Si areal coverage at 76%. The micro-Kirigami structures were fabricated, enhancing the stretchability to 50.7%± 3.71%. The F-eSiFO prepared flexible microsystem has shown great potential in MEMS-IC wafer-level manufacturing and packaging with the excellent electrical conduction capability to conform to complex and dynamic surfaces, which shows a promising future for more applications in flexible microsystems.