Implantable medical devices present several implementation challenges. In the development of neural prosthetic systems, specifically in the field of modular systems, a significant aspect is the transmission of power from the main unit to the neural stimulation and recording modules distributed along the body, together with bidirectional communication between the units. In this regard, a demodulation circuit for wired power transmission and bidirectional communication between implanted chips, implemented in 180nm CMOS technology is proposed.