QPSK Transmitter Photonics Integrated Circuit (PIC) with Integrated Micro-Transfer-Printed EAMs and Custom Driver Compatible with 3D Integration
- Resource Type
- Conference
- Authors
- Du, Xinhong; Xia, Yujie; Norvick, Viviana Arrunategui; Zilkie, Aaron; Yu, Guomin; Shafiiha, Roshanak; Dalton, James; Coldren, Larry; Schow, Clint
- Source
- 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :732-736 May, 2023
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Photonics and Electrooptics
Performance evaluation
Transmitters
Electro-absorption modulators
Photonic integrated circuits
Silicon photonics
Flip-chip devices
III-V semiconductor materials
coherent transmitter
data center
QPSK
MTP
flip-chip
- Language
- ISSN
- 2377-5726
We present a 64 Gb/s O-band Quadrature Phase Shift Keying (QPSK) coherent transmitter, consisting of a silicon photonic transmitter (TX) integrated with micro-transfer printed (MTP) InP electro-absorption modulator (EAM) and a differential driver. We also show a co-designed flip-chip compatible electronic integrated circuit (EIC) and the photonic integrated circuit (PIC) based on the previous design.