Coupled Thermal-Electrical Simulation and Validation Test for Novel High Power Delivery Design in CPU Socket Area
- Resource Type
- Conference
- Authors
- Fan, Yuehong; Yan, Hongfei; Zhong, Jack; Shen, Wei
- Source
- 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019 18th IEEE Intersociety Conference on. :996-1000 May, 2019
- Subject
- Aerospace
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Transportation
Conferences
High power CPU
power delivery
thermal-electrical analysis
- Language
- ISSN
- 2577-0799
High power CPU in high performance computing and Datacenter requires voltage regulators on the motherboard to deliver extremely high current to the CPU socket area, which brings new challenges in both thermal and electrical designs. This paper introduces a coupled thermal-electrical analysis methodology to address these challenges. The thermal validation tests are performed in functional Xeon-SP motherboard to verify the analysis results and the benefits of new power delivery solution. The test results are in good agreement with the simulations.