Silicon-on-Insulator based Micromachining Technology for Sub-Terahertz Waveguide Devices
- Resource Type
- Conference
- Authors
- Zhao, Xinghai; Glubokov, Oleksandr; Oberhammer, Joachim
- Source
- 2020 IEEE Asia-Pacific Microwave Conference (APMC) Microwave Conference (APMC), 2020 IEEE Asia-Pacific. :920-922 Dec, 2020
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Performance evaluation
Surface waves
Conferences
Silicon-on-insulator
Micromachining
Surface roughness
Rough surfaces
Silicon-on-Insulator
Sub-Terahertz
Silicon micromachining
DRIE
surface roughness
sidewall angle
metallization
alignment
bonding
- Language
The microfabrication technology based on Silicon-on-Insulator (SOI) for waveguide devices at subterahertz frequencies is investigated in this work. The relationship between the critical micromachining parameters and the performance of waveguide devices is discussed for achieving a better understanding of the SOI-based waveguide micromachining processes. Some typical sub-THz waveguide structures are demonstrated to verify the analysis to the proposed micromachining processes accordingly. SOI-based micromachining technology is one of the most promising methods to realize sub-THz components and their integration.