Direct Measurement Based Behavior Modeling for Ultra-low Inductance Silicon Carbide Power Modules
- Resource Type
- Conference
- Authors
- Shahabi, Ali; Zhang, Xuning; Lemmon, Andy; Speer, Kevin
- Source
- 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) Power Electronics and Applications (EPE'23 ECCE Europe), 2023 25th European Conference on. :1-6 Sep, 2023
- Subject
- Aerospace
Components, Circuits, Devices and Systems
Power, Energy and Industry Applications
Robotics and Control Systems
Transportation
Analytical models
Inductance
Power measurement
Silicon carbide
Simulation
Multichip modules
SPICE
Silicon Carbide (SiC)
Device modeling
Impedance measurement
Power module
- Language
This work presents a novel modeling method that combines the behavior die modeling and direct parasitic measurement for power modules. A sample of SPICE model creation process was performed on the SP6LI packages with industry leading low inductance for power commutation loop. The SPICE model of the SiC die in the power module was modeled by direct measurement of die behavior using a curve tracer and the parasitic parameters in the power module was modelled by direct impedance measurement using an impedance analyzer. Hardware testing results are also presented and compared with model simulation results for model validation. The results prove the accuracy of the proposed modeling method for SP6LI package over a wide variety of working conditions.