Large area fine line patterning by scanning projection lithography
- Resource Type
- Periodical
- Authors
- Muller, H.G.; Yanrong Yuan; Sheets, R.E.
- Source
- IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B IEEE Trans. Comp., Packag., Manufact. Technol. B Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on. 18(1):33-36 Feb, 1995
- Subject
- Components, Circuits, Devices and Systems
Power, Energy and Industry Applications
Lithography
Optical distortion
Costs
Optical films
Manufacturing
Substrates
Laminates
Optical design
Space technology
Geometrical optics
- Language
- ISSN
- 1070-9894
1558-3686
A new type of photolithography tool has been developed, addressing the specific needs of MCM manufacture. It is based on scanning projection exposure. It can expose panels at variable sizes up to 500 mm by 600 mm (typical laminate size), with an optical resolution of less than 5 /spl mu/m and an overlay accuracy of 2 /spl mu/m (typical thin film design rules). With the exposure being a mask projection, mask damage and subsequent yield problems are generally avoided.ETX