Wafer-level-integrated vertical-waveguide sub-diffraction-limited color splitters
- Resource Type
- Conference
- Authors
- Kang, S.; Benelajla, M.; Ciamain, R. Mac; Ali, F.; Papadopoulou, A.; Shramkova, O.; Witters, L.; De Vos, J.; Malinowski, P.E.; Heremans, P.; Le Thomas, N.; Figeys, B.; Gehlhaar, R.; Genoe, J.
- Source
- 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
- Subject
- Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Nuclear Engineering
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Geometry
Sensitivity
Color
Electron devices
Signal resolution
Standards
Signal to noise ratio
- Language
- ISSN
- 2156-017X
We demonstrate a new technology for splitting colors with sub-micron resolution using standard backend processing on 300 mm wafers. The color splitting is tunable via the geometry and can be designed to correspond to the color sensitivity of the human eye. The technology can result in: higher signal-to-noise ratio, better color quality and enhanced resolution for high-end cameras.