Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding
- Resource Type
- Conference
- Source
- 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-5 Sep, 2020
- Subject
Components, Circuits, Devices and Systems Bonding Liquids Silicon Electrical engineering Automation Semiconductor device reliability Scanning electron microscopy copper tin indium - Language