Research on Thermal-Decoupling Method for Chips in Press-Pack IGBT Package
- Resource Type
- Conference
- Authors
- Mo, Shenyang; Tong, Yan; Lyu, Hongshui; Wang, Laili
- Source
- 2023 2nd Asia Power and Electrical Technology Conference (APET) Asia Power and Electrical Technology Conference (APET), 2023 2nd. :470-474 Dec, 2023
- Subject
- Power, Energy and Industry Applications
Insulated gate bipolar transistors
Couplings
Temperature distribution
Layout
Thermomechanical processes
Thermal force
Finite element analysis
press-pack IGBT
package
thermal coupling
thermal-mechanical FEM
- Language
The thermal coupling is main reason inducing temperature difference in press-pack IGBT package. It produces the thermal strain on clamping electrode and disturbs the thermal and electric contact between chips and package, which aggravates unbalance of junction temperature and current on paralleled chips. In order to reduce the thermal coupling and maintain the power density of the module, we investigate the temperature and stress distribution on chips in different layout- with a thermal-mechanical FEM model. By separating the IGBTs matrix with the FRD chips, the coupling effect of IGBT decreases and its junction temperature is limited. It provides a reference to design the chips layout in press-pack package from a thermal principle.