Cross plane thermal conductance of graphene-metal interfaces
- Resource Type
- Conference
- Authors
- Vasquez Guzman, Pablo A.; Sood, Aditya; Mleczko, Michal J.; Wang, Benjamin; Wong, H.-S. Philip; Nishi, Yoshio; Asheghi, Mehdi; Goodson, Kenneth E.
- Source
- Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on. :1385-1389 May, 2014
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
General Topics for Engineers
Photonics and Electrooptics
Power, Energy and Industry Applications
Graphene
Metals
Thermal conductivity
Adhesives
Thermal resistance
Temperature measurement
Films
thermal conductance
time-domain thermoreflectance
Debye temperature
metal work function
- Language
- ISSN
- 1087-9870
We present an experimental study of cross-plane thermal conductance in metal-graphene-oxide stacks employing time-domain thermoreflectance (TDTR) measurements on Al/m/graphene/SiO 2 structures with monolayer graphene for varying adhesion metals m. Thermal conductance G in the range of 15–60 MWm −2 K −1 are found across several metals - a two-to-fourfold decrease over Al/m/SiO 2 reference values, charted against metal Debye temperature over a 274–630 K range, as well as electronic work function. The results of this study help with a better understanding of the roles of electron and phonon transport in thermal conduction across graphene-metal interfaces, revealing potential trade-offs between electrical contact resistance and heat management in graphene devices.