Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology
- Resource Type
- Conference
- Source
- 2015 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2015 International. :TS6.3.1-TS6.3.4 Aug, 2015
- Subject
Components, Circuits, Devices and Systems CMOS integrated circuits Radio frequency Inductors Yttrium Resonant frequency System integration Substrates RF system solenoidal inductor fan-out wafer level package Q-factor LNA VCO - Language