This paper explores a method for contacting Surface Mount Devices (SMD) using inkjet-printed media. A series of experiments is conducted to determine the needed layer thickness, drop size, and print parameters to facilitate adequate connections and evaluates the mechanical forces needed to break such a connection. Analysis of the joining partners using laser scan microscopy indicates necessary ink volumes between 75.1*10 3 and 800*10 3 μm 3 of connective media depending on the SMD size. The necessary amount of material is delivered to the substrate surface using inkjet printing, with the appropriate dwell voltage being determined in a separate experiment. After sintering for 10 minutes at 150°C, the inkjet-printed connections demonstrated electrical conduction in testing but showed 43% less resistance to shear forces, when compared to conventionally soldered connections, indicating a need for further optimization regarding the adhesive properties of the ink. The study provides insights for developing mechanically and electrically stable connections using inkjet-printed media, although further refinement is needed with regards to ink formulation and sintering time.