Low T/sub g/ epoxy adhesives for thermal management
- Resource Type
- Conference
- Authors
- Chung, K.K.T.; Avery, E.; Boyle, A.; Dreier, G.; Koehn, W.; Govaert, G.; Theunissen, D.
- Source
- 8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International. :264-277 1990
- Subject
- Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Thermal management
Packaging
Thermal stresses
Thermal conductivity
Wiring
Circuit stability
Thermal stability
Acceleration
Printed circuits
Design engineering
- Language
The functional analysis of adhesives in microelectronics is considered. The authors then address the thermally induced stress on the microelectronic product at all levels of packaging, with major emphasis on component and substrate levels. They demonstrate various ways of reducing or eliminating this stress, which is a major cause of device failure. One of the proven methods is through the use of low T/sub g/ epoxies with high thermal stability. Attention is given to thermal management in connection with multichip modules.ETX