The long-term reliability of the interconnection in crystalline silicon solar cell photovoltaic (PV) modules is crucial for ensuring optimal performance for up to 25 years. Most failures in crystalline silicon PV modules are caused by breakage of the solder joint interconnection during daily thermal cycles. The conventional interconnection technologies use low-melting-point materials such as lead or lead-free solder, which lack sufficient heat resistance. As a result, improved interconnection technologies are needed. Nickel micro-plating bonding (NMPB) is a new technology that replaces lead or lead-free solder bonding with copper wires bonded with Ni electroplating film. To evaluate the lifespan of NMPB interconnected PV module, modules were fabricated by using both NMPB and solder bonding with EVA and further encapsulants. Thermal cycling (TC) tests were performed, and the results showed that the retention rate of the maximum output power (P max ) of NMPB interconnected PV module was 12.8% higher than that of solder bonding module after TC cycles.