High resolution metal lift-off characterization
- Resource Type
- Conference
- Authors
- Sutton, A.K.; Steen, S.
- Source
- Proceedings of the 15th Biennial University/Government/ Industry Microelectronics Symposium (Cat. No.03CH37488) University/government/industry microelectronics symposium University/Government/Industry Microelectronics Symposium, 2003. Proceedings of the 15th Biennial. :94-98 2003
- Subject
- Power, Energy and Industry Applications
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Lithography
Substrates
Resists
Space technology
Focusing
Solvents
Streaming media
Image segmentation
Optical films
Optical interconnections
- Language
- ISSN
- 0749-6877
This project explores the challenges associated with the scaling of the standard metal lift off process to the 0.13 um technology node using DUV lithography. The analysis Will be done on a sequence of nested lines and spaces using a phase shift mask. PROLITH, a powerful Lithography simulation tool, will be employed to streamline the lithography optimization segment of the process. Experimental manipulation of the focus, dose and other optical parameters during exposure will then be evaluated through top-down and cross-section SEM images. Process modifications for improved linewidth and undercut control are recommended.