Effect of interconnect plasticity on soldering induced residual stress in thin crystalline silicon solar cells
- Resource Type
- Conference
- Authors
- Tippabhotla, Sasi Kumar; Radchenko, Ihor; Song, Wenjian; Tamura, N.; Tay, Andrew A. O.; Budiman, A. S.
- Source
- 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :734-737 Nov, 2016
- Subject
- Components, Circuits, Devices and Systems
Residual stresses
Silicon
Soldering
Photovoltaic cells
Material properties
Copper
- Language
Soldering of copper interconnects at ∼220 °C induces residual stresses in the crystalline silicon solar cells. These residual stresses may become detrimental in the context of thinner silicon cells (