Highly integrated advanced power electronic systems for automotive applications
- Resource Type
- Conference
- Authors
- Sommer, J.-P.; Hofmann, Th.; Neumann, A.; Podlasly, A.; Michel, B.
- Source
- 3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-5 Sep, 2010
- Subject
- Components, Circuits, Devices and Systems
Communication, Networking and Broadcast Technologies
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Cooling
- Language
One of the most important challenges in advanced automotive electronics is to manage increasing power within smaller and smaller devices. Further important requirements are system cost reduction and high reliability. Within the VISA project (fully integrated power electronics for automotive, [1]), funded by the German government, new highly integrated packaging technologies are under investigation which cover active as well as passive components. Some essential technological insights will be presented first.