Fixed-outline thermal-aware 3D floorplanning
- Resource Type
- Conference
- Authors
- Linfu Xiao; Sinha, Subarna; Jingyu Xu; Young, Evangeline F.Y.
- Source
- 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC) Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific. :561-567 Jan, 2010
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Through-silicon vias
Temperature
Silicon
Heat sinks
Thermal management
Space technology
White spaces
Three-dimensional integrated circuits
Computational modeling
Integrated circuit modeling
- Language
- ISSN
- 2153-6961
2153-697X
In this paper, we present a novel algorithm for 3D floorplanning with fixed outline constraints and a particular emphasis on thermal awareness. A computationally efficient thermal model that can be used to guide the thermal-aware floorplanning algorithm to reduce the peak temperature is proposed. We also present a novel white space redistribution algorithm to dissipate hotspot. Thermal through-silicon via (TSV) insertion is performed during the floorplanning process as a means to control the peak temperature. Experimental results are very promising and demonstrate that the proposed floorplanning algorithm has a high success rate at meeting the fixed-outline constraints while effectively limiting the rise in peak temperature.