Automated Performance of On-Wafer Calibration and Characterization Using Non-Contact Probes
- Resource Type
- Conference
- Authors
- Sertel, Kubilay
- Source
- 2019 92nd ARFTG Microwave Measurement Conference (ARFTG) ARFTG Microwave Measurement Symposium (ARFTG), 2019 92nd. :1-4 Jan, 2019
- Subject
- Aerospace
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Probes
Calibration
Standards
Antennas
System-on-chip
Coplanar waveguides
Antenna measurements
On-wafer probing
On-wafer calibration
Noncontact probes
mmW
THz
- Language
We present the repeatability performance of automated non-contact on-wafer probing for millimeter-wave and terahertz band applications. Based on the antenna-coupled noncontact probing approach, we incorporated computer control into the existing hardware to automate the test wafer manipulation. A digital microscope with pattern recognition is used to precisely control the alignment of on-wafer antennas at the test ports to minimize positioning repeatability errors. Commercial-off-the-shelf micro-positioners used in our system allow for sub-micron repeatability in device alignment, significantly improving repeatability. Furthermore, the non-contact system does not need vertical translation (conventionally used for probe landing), thus can achieve highly repeatable measurements. The repeatability performance of the automated system presented here is thus limited by the drift of the frequency extenders used.