Process design and optimization for environmentally conscious printed circuit board assemblies
- Resource Type
- Conference
- Authors
- Rupp, G.; Graham, S.
- Source
- Proceedings of the 1995 IEEE International Symposium on Electronics and the Environment ISEE (Cat. No.95CH35718) Electronics and the environment Electronics and the Environment, 1995. ISEE., Proceedings of the 1995 IEEE International Symposium on. :95-99 1995
- Subject
- Components, Circuits, Devices and Systems
Geoscience
Process design
Design optimization
Surface-mount technology
Qualifications
Volatile organic compounds
Soldering
Organic materials
Waste materials
Effluents
Printed circuits
- Language
This paper discusses an engineering approach to the qualification of water based flux as a substitute for conventional alcohol based volatile organic compound (VOC) flux and utilization of "No-Clean" soldering material, virtually eliminating saponified waste water effluent and VOC emissions typically associated with surface mount technology (SMT) printed circuit board assembly (PCBA). The information and experiences are provided through a discussion of critical equipment, material requirements and evaluations, as well as the selection methodology and criteria.