Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions
- Resource Type
- Conference
- Authors
- Langbauer, Thomas; Mentin, Christian; Rindler, Michael; Vollmaier, Franz; Connaughton, Alexander; Krischan, Klaus
- Source
- 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2019 25th International Workshop on. :1-6 Sep, 2019
- Subject
- Components, Circuits, Devices and Systems
Integrated circuit modeling
Temperature measurement
Temperature dependence
Circuit simulation
Transient analysis
Computational modeling
Conferences
- Language
- ISSN
- 2474-1523
Thermal management becomes critical as loss-related component parameters become more highly temperature dependent. Although thermal simulation based on component losses is common, this work proposes closing the loop between electrical and thermal simulations with a transient system-level approach; enabling temperature dependent component parameters during circuit simulation. For a boost converter, the overall system efficiency and component losses are estimated by combining circuit simulation with the corresponding temperature distribution calculated with transient 3D-FVM. Simulations demonstrate how the overall system efficiency is influenced by the component temperature, especially during transient processes e.g. the system start up. Using the proposed co-simulation approach the temperature on one semiconductor surface could be estimated with good accordance to measured temperatures (+3.1 % / 2.68 °C) during 60 s of transient start up.