A New Multi-Stimuli-Based Simulation Method for ESD Design Verification
- Resource Type
- Conference
- Authors
- Di, Mengfu; Pan, Zijin; Li, Cheng; Wang, Albert
- Source
- 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2021 5th IEEE. :1-3 Apr, 2021
- Subject
- Bioengineering
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Semiconductor device modeling
Analytical models
Design methodology
Predictive models
Electrostatic discharges
System-on-chip
Manufacturing
TCAD
ESD protection
TLP
HBM
- Language
This paper analyzes TCAD ESD simulation for both HBM zapping using real-world HBM ESD waveforms as stimuli and TLP testing using square wave TLP pulse trains as stimuli. It concludes that TCAD ESD simulation using either HBM waveforms or TLP pulse trains, alone, is insufficient. We introduce a new mixed-mode simulation flow using combined HBM and TLP stimuli to achieve ESD design prediction, which was validated in 28nm bulk CMOS and 45nm SOI CMOS.