A 1,000x improvement in computer systems by bridging the processor-memory gap
- Resource Type
- Conference
- Authors
- Or-Bach, Zvi
- Source
- 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2017 IEEE. :1-4 Oct, 2017
- Subject
- Components, Circuits, Devices and Systems
Power, Energy and Industry Applications
Three-dimensional displays
Silicon germanium
Substrates
Silicon
Through-silicon vias
Micrometers
Computer architecture
processor-memory gap
3D memory
- Language
For over 4 decades the gap between computer processing speed and memory access has grown at about 50% per year, to more than 1,000x today. This provides an excellent opportunity to enhance the single-core system performance. An innovative 3D integration technology combined with re-architecting the integrated memory device is proposed to bridge the gap and enable a 1,000 x improvement in computer systems. The proposed technology utilizes processes that are widely available and could be integrated in products within a very short time.