Improvement of particle outbreak for chamber wall deterioration
- Resource Type
- Conference
- Authors
- Kawabata, Y.; Watanabe, M.; Ohtake, K.; Yajima, T.; Endou, M.; Aoyama, M.; Imaoka, K.
- Source
- ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005. Semiconductor Manufacturing Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on. :483-486 2005
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Etching
Voltage
Plasma measurements
Constitution
Fault detection
Plasma applications
Semiconductor devices
Particle measurements
Ceramics
Data mining
- Language
- ISSN
- 1523-553X
We used fault detect and classification (FDC) application to collect sensor's data of tool. The origin of particles is specified by correlating the data with plasma parameters. We proved particles were caused by the deterioration of chamber wall. The deterioration is the coat of Al alumilite peels off from chamber wall. After recoating the coat of Al alumilite on chamber wall, the outbreak of particles reduced.