Reliability evaluation methodology for chip-package interaction - die corner edge failure mechanism
- Resource Type
- Conference
- Authors
- Chin, Melida; Marathe, Amit
- Source
- 2010 IEEE International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2010 IEEE International. :453-457 May, 2010
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Power, Energy and Industry Applications
Failure analysis
Testing
Packaging
Qualifications
Environmentally friendly manufacturing techniques
Force measurement
Vehicles
Finite element methods
Protocols
Delamination
CPI
crack driving force
crackstop
reliability
- Language
- ISSN
- 1541-7026
1938-1891
A novel reliability qualification methodology to evaluate chip-package interaction (CPI) is presented. Experimental and finite element analysis results are combined in a new protocol that provides solutions to address the need of CPI test vehicles for pre-qualification purposes, more accurate CPI risk projection, and more flexibility for productization.