Characterization of bonding interface prepared by room temperature bonding after flattening by thermal imprint process
- Resource Type
- Conference
- Authors
- Kurashima, Yuichi; Maeda, Atsuhiko; Takagi, Hideki
- Source
- 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on. :1-4 Apr, 2013
- Subject
- Computing and Processing
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Bonding
Gold
Films
Surface treatment
Silicon
Rough surfaces
Surface roughness
room temperature bonding
thermal imprint
- Language
We developed the room temperature bonding of Au film flattened by thermal imprint process. The Au film surfaces were flattened by thermal imprint process. As a result, the flattening process was effective in case of the low bonding load or rougher Au surface. And we also apply developed process to bonding of seal ring patterns fabricated by Au electroplating. The surface of Au film could be successfully flattened by the thermal imprint process. As a result, large bonding strength was obtained for seal ring patterns with a width of 100 μm.