Fork-Coupled Resonators for Characterization of Mold Material for 5G Applications
- Resource Type
- Conference
- Authors
- Kanitkar, Abhijeet; Chernobryvko, Mykola; Rossi, Marco; Ndip, Ivan; Braun, Tanja; Muller, Friedrich; Lang, Klaus Dieter; Wieland, Marcel; Goetze, Christian; Halim, Saquib Bin; Trewhella, Jean
- Source
- 2020 23rd International Microwave and Radar Conference (MIKON) Microwave and Radar Conference (MIKON), 2020 23rd International. :177-180 Oct, 2020
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Microwave measurement
5G mobile communication
Resonant frequency
Dielectric measurement
Frequency measurement
Scattering parameters
Resonators
FoWLP
Mold (EMC)
fork-coupled resonator
material characterization
5G
mm-Wave
- Language
The dielectric properties of materials applied in advanced packaging technologies such as Fan-out Wafer Level Packaging (FoWLP) must be precisely known at millimeter-wave (mm-Wave) frequencies for optimized package design. In this paper, the applicability of fork-coupled resonators for the electromagnetic characterization of an epoxy molding compound (EMC) for 5G applications is investigated. The analysis is experimentally verified by means of measurements of fabricated test structures on EMC (Nagase R4601-X65) material for 5G applications in frequency bands of 26.5-29.5 GHz and 37-40 GHz.