Influence of thermomigration on creep behavior of Cu/Sn0.7Cu/Cu solder joint
- Resource Type
- Conference
- Authors
- Wei, Guo-qiang; Ma, Si; Li, Da-lei; Jia, Yin-pei; Liu, Heng-lin
- Source
- 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :20-24 Aug, 2017
- Subject
- Components, Circuits, Devices and Systems
Creep
Soldering
Stress
Temperature
Isothermal processes
Electronics packaging
Couplings
solder joint
thermomigration
creep lifetime
fracture failure
- Language
For revealing the influences of thermomigration effect (TM) on the creep properties of interconnecting solder joints in electronic packaging industry, the creep behavior of Cu/Sn0.7Cu/Cu solder joints were researched under temperature gradient of 1043°C/cm and isothermal temperature of 100°C(median temperature) with different shear stress, respectively. It is approved that the creep lifetime of the solder joints is largely reduced under TM effect and this trend is more evident with shear stress increasing. It is also affirmed that since the creep fracture position shifts from the center to the hot end in the solder joints compared with that under isothermal temperature, this suggests that the mechanical properties in the solder joints are nonuniform. The degradation of the creep properties of the solder joints induced by TM effect will bring a new reliability issue in electronic packaging industry.