Smart packages and interconnect substrates-computing functions using signal line coupling
- Resource Type
- Conference
- Authors
- Lipeng Cao; Krusius, J.P.
- Source
- 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) Electronic components and technology Electronic Components & Technology Conference, 1998. 48th IEEE. :632-637 1998
- Subject
- Components, Circuits, Devices and Systems
Electronics packaging
Integrated circuit packaging
Delay
Transmission line theory
Integrated circuit interconnections
System performance
Coupling circuits
Transmission line discontinuities
Propagation losses
Distributed parameter circuits
- Language
- ISSN
- 0569-5503
Signal transmission delays in electronic packages and integrated circuits are key factors limiting system performance. We demonstrate that certain computing functions can be achieved by manipulating signal line inductive and capacitive coupling, as well as signal line discontinuities in lossless transmission lines. Computation is performed during signal transmission. This could alleviate signal transmission delay penalties in some applications. The time domain theory underlying this approach is presented. The concepts of static and dynamic computation are proposed. The computing function is specified in a truth table. Linear least square (LLS) and heuristic algorithms are used to construct transmission line structures that perform the desired computational tasks.