Development of High-Density Hybrid Substrate for Heterogeneous Integration
- Resource Type
- Conference
- Source
- 2021 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2021 IEEE. :5-8 Nov, 2021
- Subject
Bioengineering Components, Circuits, Devices and Systems Engineered Materials, Dielectrics and Plasmas Photonics and Electrooptics Fabrication Packaging Substrates fan-out chip-last hybrid substrate chiplets heterogeneous integration Interconnect-layer - Language
- ISSN
- 2475-8418