Experimental and Numerical Investigation on Liquid Assisted Air Cooling Solution
- Resource Type
- Conference
- Authors
- Tian, Wenbin; Kulkarni, Devdatta; Zhang, Ming; Fan, Yuehong
- Source
- 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018 17th IEEE Intersociety Conference on. :73-77 May, 2018
- Subject
- Aerospace
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Transportation
Atmospheric modeling
Numerical models
Cold plates
Liquids
Temperature measurement
Electrical resistance measurement
TDP
Xeon Processor
HPC
LAAC
Numerical Simulation Modelling
CFD
FloTHERM
- Language
- ISSN
- 2577-0799
Thermal Design Power (TDP) of Intel Xeon and Intel Xeon Phi Processor is getting higher and higher from generation to generation as High Performance Computing (HPC) industry continuously pursues extreme performance target. It is challenging to cool such high TDP processors with solely passive air cooling solution under the same form factor and boundary conditions. Hence advanced air cooling solution, the Liquid Assisted Air Cooling (LAAC), is introduced to fix such thermal challenges. Experimental results from a case study with Intel® Server Board S7200AP are presented in this paper to demonstrate LAAC’s cooling capability and this paper also proposes a new methodology of numerical simulation modelling with Computational Fluid Dynamics (CFD) tool as FloTHERM to predict LAAC’s cooling capability.