Plan-View to Cross-Section Conversion Work-Flow for Defect Analysis
- Resource Type
- Conference
- Authors
- Kral, Zdenek; Landin, Trevan
- Source
- 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-4 Jul, 2018
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Ion beams
Imaging
Carbon
Platinum
Three-dimensional displays
Image resolution
Work-Flow
FIB-SEM
TEM lamella
Defect analysis
3D Fin-FET
STEM
- Language
- ISSN
- 1946-1550
An advanced sample preparation technique is demonstrated on a 3D Fin-FET structure. We present a step-by-step workflow to localize/mark a target structure (defect) in the horizontal plane of the sample and convert it into a vertical cross-section lamella which is inspected with STEM.