20 Milliwatt class ultralow power integrated OCXO using polyimide and thin film metal connection suspended in vacuum packaging
- Resource Type
- Conference
- Authors
- Suzuki, Takanori; Muroyama, Masanori; Taira, Tomoyuki; Kimura, Noritoshi; Tsukamoto, Takashiro; Tanaka, Shuji
- Source
- 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2017 19th International Conference on. :435-438 Jun, 2017
- Subject
- Bioengineering
Components, Circuits, Devices and Systems
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Polyimides
Substrates
Heating systems
Bonding
Wires
Metals
Power demand
OCXO
Low-power consumption
MEMS-CMOS integration
Packaging technology
Thin film connection
Thermal isolation structure
- Language
- ISSN
- 2167-0021
This paper proposes a 20 mW class low-power and miniaturized oven controlled crystal oscillator (OCXO) by combination of the following two methods. (1) A crystal resonator and a CMOS-LSI for oscillation and oven control circuits are integrated for realizing an integrated OCXO chip. (2) The integrated chip is connected with thin film metal interconnection on a thin polyimide film and is suspended by an ultrasonic bonding technique in vacuum packaging. Based on the thermal analysis, we designed the thermally isolated connection. Experimental results showed that the fabricated OCXO successfully saved about 90% power consumption compared with the existing wire bonding implementation.