Towards IoT-assisted Non-Intrusive Monitoring of Thermal Variation on Building Envelope
- Resource Type
- Conference
- Authors
- Khan, Naima; Roy, Nirmalya
- Source
- 2023 IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops) Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops), 2023 IEEE International Conference on. :270-271 Mar, 2023
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
General Topics for Engineers
Robotics and Control Systems
Signal Processing and Analysis
Temperature sensors
Image sensors
Temperature measurement
Conferences
Buildings
Inspection
Sensor phenomena and characterization
Building envelope
Sensors
Thermal images
Thermal condition
Non-intrusive monitoring
Machine learning
- Language
- ISSN
- 2766-8576
Miscellaneous surface damages and air leakages through building components significantly affect energy con-sumption as well as the thermal comfort of inhabitants in building. Formal thermal inspection of built environment by professionals is expensive and intrusive, often inconclusive and inconvenient, which also requires a lot of parameter tuning. Besides, non-intrusive monitoring with low-cost sensors and ther-mal images can provide data-driven knowledge of the thermal properties of built surfaces and also helps in accelerating the process of thermal inspection by professionals. We introduce novel quantitative approaches based on non-intrusive temper-ature and humidity sensor data as well as thermal images which simultaneously learn spatial and temporal thermal characteristics from different places in the inside built environment and provide data-driven thermal variation analysis for identifying potential damage-prone and air-leaking areas in order to reduce energy loss through building components.